Design for Excellence (DfX)
Bringing all the –ilities together
Monday
Introduction
What Constitutes DfX
Reliability
Safety
Electromagnetic Compatibility
Usability
Testability
Built-In SelfTest
Manufacturability
Maintainability
Diagnosability
Others
Failure Mode Effects Analysis (FMEA)
A Common Platform for all the -ilities
Design and Test for Electromagnetic Compatibility
Tuesday
Design for Reliability
New
paradigms in design for reliability
Designing
products for long life
Design
FMEA for avoiding failures
Accelerated
life testing models
Weibull
analysis for life test data
Design for Safety
Evidence-based
safety design methods
Hazard
analysis and risk mitigation techniques
Active
safety vs. passive safety
Testing
for safety
Wednesday
Design for Manufacturability
Customer
Satisfaction Requirements
Functional Responsibilities of DFM
Concurrent Engineering
Early Supplier Involvement
Defining the Process
Six Sigma and Statistical Thinking
Understanding and Controlling Process Variation
Understanding and Implementing a World Class Quality System
Process Characterization Concepts
Evaluating Printed Circuit Board Designs
The "Black Belt" Quality Certification Program
Improve Process Availability and Yield
Use of Process FMEA to reduce vulnerability in
manufacturing
Reliability centered maintenance
Thursday
Design for Usability
Usability Terms
Usability Engineering
Usability Documentation
Usability Measures
False Alarms – A consequence of poor usability
Automatic Testing and ATE Strategies
Design for Testability
What is Design for Testability?
Quality as a Function of Yield and Test Coverage
Fault Models
Effect of Time-to-Market On Profits
Approaches to Design for Testability
Ad Hoc Design for Testability
Structured Design for Testability
Extended Design for Testability Or Built-In Self Test
Design for Testability Attributes
Controllability
Observability
Others
Evaluating Designs for Testability
Dependency Models
Testability Checklists
PCOLA/SOQ
Other Testability Analysis tools
Structured Design for Testability
Technical Goals of Testable Designs
General Structure of Scan
Boundary Scan Structure (JTAG/IEEE-1149.1)
Boundary-Scan Operational Modes
Non-Invasive Operational Modes
Pin Permission Operational Modes
Boundary-Scan Description Language (BSDL)
Boundary-Scan Tests
Mixed Signal Boundary Scan - IEEE-1149.4
AC EXTEST Using the IEEE-1149.6
Other Testability Guidelines and Organizations
SMTA Testability Guidelines
Testability Management Action Group (TMAG)
IEEE-1149.7 and beyond..
Friday
Design for Built-In Self Test
Technical Approach to BIST
Forms of Built-In Self Test
Continuous Monitoring (CM)
Initiated Bit (I-BIT)
Operational Readiness Test (ORT)
Elements of a BIST Architecture
BIST Classification
BIST Using Set/Scan Logic
Signature Analyzer
Pseudo-Random Signal Generator
Linear Feedback Shift Register from Scan Cells
Built-In Logic Block Observer (BILBO)
BIST Signal Generation tools
BIST Response Collection tools
BIST Architectures
Built-in Test (BIT) Software
Why use BIT Software?
BIT Software Considerations
Guidelines for Software BIT
Selecting a Software Language
Performance Monitoring Software
Failure Analysis Software
Fault Filtering
Heuristics in BIT
BIT False Alarms
Evaluating BIT
BIT Specification
Design for Maintainability
MIL-HDBK-470A
The Support Concept –
Design for Operational Readiness
Preventive vs. Corrective Maintenance
Human Engineering
Design for Maintainability Requirement
Interaction between Human and Product
Design choices of switches, knobs, levers, wheels, etc.
Anthropometrics
Testability in Maintenance
Diagnostics in Maintenance
Built-In Test in Maintenance
Prognostic
Maintainability Analyses
Equipment Downtime Analysis
Maintainability Design Evaluation
Failure Mode Effects Analysis (FMEA)
Testability Analysis
Human Factors Analysis
Design for Diagnosability
Other –illities
Bringing it All Together Under a Single Common Criterion
Louis Y. Ungar, President, A.T.E. Solutions, Inc.
Louis Y. Ungar founded A.T.E. (Advanced Test Engineering) Solutions, Inc. in 1984 and built it to be the leading independent testability consulting and educational firm. He has taught ATE, Testability and Built-In Self Test courses at the University of California at Los Angeles (UCLA) and throughout industry and governments. Louis is also the founding President of the Testability Management Action Group (TMAG), a consultant to The American Society of Test Engineers (ASTE), has served as Testability Chair for the Surface Mount Technology Association (SMTA) and has served on committees for various IEEE standards, including those of IEEE Std.1149.x. He has widely published on Design for Testability and Diagnosability topics and obtained patents for Built-In Self Test circuits. Mr. Ungar holds a B.S.E.E. and Computer Science degree from UCLA and has completed course work towards a M.A. in Management.
Dr. William Duff,
President, SEMTAS Corporation
Bill
received a BEE degree from George Washington University in 1959, a MSEE degree
from Syracuse University in 1969, and a DScEE degree from Clayton University
in 1977. Bill is a founder and President of SEMTAS and is internationally
recognized as a leader in the development of engineering technology for
achieving electromagnetic compatibility (EMC) in communication and electronic
systems. He has 42 years of
experience in EMC analysis, design, test and problem solving for a wide
variety of communication and electronic systems.
Bill has developed and applied EMC analysis, modeling and simulation
techniques for evaluating EMC within and between communication and electronic
systems operating in severe electromagnetic environments. The models were
developed for Rome Air Development Center (RADC). The models were also used by
the US Navy for “topside design” of ships and are
used to evaluate EMC and determine antenna separation requirements for
various types of civilian and military communication systems that are
collocated on towers, rooftops, ships, aircraft, vehicles, etc.
Bill has written more than 40 technical papers and four books on EMC.
He is a past president of the IEEE EMC Society and a past IEEE Director
of Division IV, Electromagnetic and Radiation.
He has served a number of terms as a member of the EMC Society Board of
Directors and is currently Chairman of the EMC Society Fellow Evaluation
Committee and an Associate Editor for the EMC Society Newsletter. Bill
has received a number of IEEE awards including the Lawrence G. Cumming Award
for Outstanding Service, the Richard R. Stoddard Award for Outstanding
Performance and a “Best Paper” award.
He was elected to the grade of IEEE Fellow in 1981. He is a NARTE
Certified EMC Engineer.
Joe Belmonte,
Principal Consultant, ITM Consulting
Joe
has been a process engineer and process engineering manager in the electronic
manufacturing industry for over 30 years with experience in all aspects
of electronic product assembly operations.
He holds an Associate Degree in Mechanical Design from Wentworth
Institute in
Boston
and a Bachelor of Science Degree in Operations Technology from
Northeastern
University
in
Boston
. From 2007 to 2009 he worked at Bose
Corporation as the Manager of Advanced Manufacturing Engineering and as a
Supplier Engineer and was responsible for the development and implementation
of all new electronic manufacturing processes at Bose Manufacturing Operations
and the training of all Bose Electronic Manufacturing/Process Engineers.
From 1995 to 2007 Joe was a Consultant at Cookson Electroics/Speedline
Technologies Performance Solutions Group and Project Manger at Speedline
Technologies Advanced Process Group where he worked with customers on quality
and cycle time improvement projects including performing detailed assessments
of their entire manufacturing operation to identify strengths and
opportunities for improvement. As Project Manager at Speedline
Technologies Joe’s primary responsibilities included managing advanced
process development projects (Lead Free Process Development Program, High
Volume Fuel Cell Process Development Program, and Miniature Component Assembly
Process Development), working with customers on process improvement programs,
and providing process training. From
1978 to 1995, Joe worked as a process engineer and process engineering manager
at Motorola ISG
. Joe has been a senior member of the Society of Manufacturing Engineers (SME)
for over 20 years, has served as a member of the Electronic Manufacturing
Association of SME Board of Advisors and currently serves as a member of the
SMTA Board of Directors.
Dev Raheja,
President, Design for Competitiveness
Dev
G. Raheja, is a world leader in reliability engineering with over 30 years
experience as an educator, innovator, author, practitioner and consultant. He
has done consulting and training for automotive, aerospace, defense and many
high tech corporations. Mr. Raheja is credited with turning around two
U.S.
manufacturing companies from going out of business to achieving No. 1 market
leader position. His prior affiliations include: senior management consultant
responsible for risk management and system assurance at Booz-Allen &
Hamilton, Inc.; Chief Engineer for corporate product reliability and safety at
Cooper Industries; manager of manufacturing engineering, and quality assurance
at GE; and Design Engineer at Standard Screw Company. He has received several
awards including the ASQ Austin Bonis Reliability Education Advancement Award.
He has chaired several technical committees; ex-chairman of EIA Software
Reliability sub-committee and the Ultra High Reliability Engineering Committee
of Aerospace Industries Association and the SAE G-11 Committee. Mr. Raheja is
author of the book Product Assurance
Technologies: Principles and Practices and
He has also served as the Adjunct Professor at the
Graduate
School
,
University
of
Maryland
for its PhD program on reliability engineering. He serves on the AIAA S-102
R&M Standards Working Group to develop standards on Dependability,
Operational Availability, Software Reliability and related standards. He is the
Chairman of IEEE Design for Reliability Committee.